Tafole ea parameter ea sehlahisoa
| Nd:Ce: Lipontšo tsa tekheniki tsa lithupa tsa kristale tsa laser tsa YAG |
| Ho tsepamisa mohopolo oa doping | Nd:0.1~1.4at%,Ce:0.05~0.1at% |
| Mokhoa oa kristale | <111>+50 |
| Phetiso e sothang pele | s0.1A/inch |
| Karolelano ea ho fela | ≥25dB |
| Boholo ba sehlahisoa | Diameter≤50mm, Length≤150 mmSlats le li-discs li ka etsoa ho latela litlhoko tsa bareki. |
| Mamello ya dimensional | Bophara:+0.00/-0.05mm, Bolelele:±0.5mm |
| Cylindrical surface processing | Ho sila hantle, ho bentša, ho roala |
| Qetella ho bapisa sefahleho | ≤ 10” |
| The perpendicularity ea qetello sefahleho ho ea molamu axis | ≤ 5' |
| Qetella ho bata ha sefahleho | 入/10 @632.8nm |
| Boleng ba bokaholimo | 10-5 (MIL-0-13830A) |
| Chamfer | 0.15+0.05mm |
| Ho roala | S1/S2:R@1064nms0.2% |
| S1:R@1064nm≤0.2%，S2:R@1064=20+3% |
| S1:R@1064nm≤0.2%，S2:R@1064nmz99.8% |
| Litsamaiso tse ling tsa lifilimi li ka etsoa ka mokhoa o ikhethileng. |
| Moeli oa tšenyo ea laser ea lera la filimi | ≥500MW/cm2 |
| Laser wavelength | 1064nm |
| Bolelele ba maqhubu a ho monya a diode | 808nm |
| Lenane la refractive | 1.8197@1064nm |
| khethehileng | Metallization ea bokaholimo |
| Qetella sefahleho sa wedge angle, concave/convex surface, joalo-joalo. |
